SIC (silicon carbide) and GaN (gallium nitride) have emerged as the preferred material for making packages for high-intensity semiconductors and power devices. Such materials can support high temperature power circuits and withstand high voltage.
At the same time the power semiconductor market is undergoing a period of change. Driven by the need for increased power density and system efficiency, wide band gap (WBG) materials such as SiC and gallium nitride (GaN) are being adopted in many applications. These WBG devices require new packages, materials, and assembly methods.
According to this study, over the next five years the New Packages and Materials for Power Devices market will register a xx% CAGR in terms of revenue, the global market size will reach US$ xx million by 2024, from US$ xx million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in New Packages and Materials for Power Devices business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of New Packages and Materials for Power Devices market by product type, application, key manufacturers and key regions and countries.
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This study considers the New Packages and Materials for Power Devices value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Wire Bonding Packaging
Gallium Nitrid (GaN)
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Telecommunications and Computing
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Middle East & Africa
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
MITSUBISHI ELECTRIC CORPORATION
Orient Semiconductor Electronics Ltd.
Infineon Technologies AG
Efficient Power Conversion Corporation
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
To study and analyze the global New Packages and Materials for Power Devices consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of New Packages and Materials for Power Devices market by identifying its various subsegments.
Focuses on the key global New Packages and Materials for Power Devices manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the New Packages and Materials for Power Devices with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of New Packages and Materials for Power Devices submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Aira McDonald is a seasoned journalist with nearly 15 years experience. While studying journalism at the University of Detroit,, Aira found a passion for finding engaging stories. As a contributor to PR News Globe, Aira mostly covers human interest pieces.